UMC (United Microelectronics Corp.) announced that the company is going to license its low-power 40-nm technology to Fujitsu Semiconductor for roughly five billion yen (US$48.2 million; US$1=103.788 yen) in exchange of around 9.3% stake in the two companies' new chip production joint venture, along with a seat on the board of directors, reported China Times on August 29. The joint venture, a 12-inch wafer plant in Mie Prefecture in Japan, will have a monthly capacity of 28,000 wafers for use in image sensors and automobile electronics. The cooperation indicates UMC's return to the Japanese market after liquidating its subsidiary UMC Japan in late 2012.